πŸ“‹ Case Study

Automotive Tier-1 Battery Management System (BMS) Radiated Emissions Failure

Failed CISPR 25 Class 5 radiated emissions at 120–180 MHz due to DC-DC converter switching noise coupling into CAN bus traces

πŸ—οΈ Project Overview

High-voltage 800V BMS for next-gen EV platform

🎯 Challenge

Failed CISPR 25 Class 5 radiated emissions at 120–180 MHz due to DC-DC converter switching noise coupling into CAN bus traces

πŸ”§ Design Approach

Redesigned PCB stackup with dedicated ground plane under high-speed traces; added common-mode chokes on CAN lines; relocated ferrite beads to filter converter output ripple

πŸ“ Design Diagram

BMS Radiated Emissions MitigationDC-DC ConverterSWfsw = 2 MHzCAN Bus TracesCM ChokeGround Plane (Solid)Zgnd ↓Coupling Pathk β‰ˆ 0.018Z = 42 Ξ© @ 150 MHzNoise Coupling β†’ CANMitigation StrategyFerrite BeadRelocated to filter rippleTest ResultPASS CISPR 25 Class 5Ξ”L = 12 dB↓ @ 150 MHz

AI-generated project design illustration

πŸ“ Key Calculations

Coupling Path Impedance

Z = 2Ο€f Γ— L + R
Result: 42 Ξ© @ 150 MHz
Determined choke inductance needed for >30 dB attenuation

Near-Field Coupling Coefficient

k β‰ˆ (h/d)Β²
Result: 0.018
Validated spacing improvement reduced coupling by 72%

πŸ“Š Results

Passed CISPR 25 Class 5 with 8.2 dB margin at worst frequency; no CAN communication errors observed across thermal cycling (-40Β°C to +105Β°C)

πŸ’‘ Lessons Learned

  • β€’PCB layer ordering dominates high-frequency EMI more than component selection alone
  • β€’CAN common-mode noise must be addressed at the transceiver pinβ€”not just at connectors

βœ… Key Takeaways

  • 1PCB layer ordering dominates high-frequency EMI more than component selection alone
  • 2CAN common-mode noise must be addressed at the transceiver pinβ€”not just at connectors